A Shape Memory Polymer with Improved Shape Recovery

Thermally actuated shape memory polymers (SMPs) interest, both academically and industrially, due to their ability to memorize a permanent shape that is set during processing and a temporary shape that is later programmed by manipulation above a critical temperature, either Tg or Tm. However, the thermal triggering process for SMPs is usually retarded compared to that of shape memory alloys, because the thermal conductivity of polymers is much lower (<0.30 W/m⋅K). In the present study, we incorporated a highly thermal conducting filler into a shape memory matrix to increase its thermal conductivity and therefore, shorten the heat transfer progress. A mathematical was worked out that quantitatively relates the material’s thermal conductivity with the heat transfer time, τ, also defined as a shape memory induction time. The model fit nicely with our experimental data. In addition, mechanical reinforcement was observed with the addition of this rigid thermal conducting filler.